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1

Mechanical reliability of Sn-rich Au–Sn/Ni flip chip solder joints fabricated by sequential electroplating method

Jeong-Won Yoon, Hyun-Suk Chun, Bo-In Noh, Ja-Myeong Koo, Jong-Woong Kim, Hoo-Jeong Lee, Seung-Boo Jung

Journal:

Microelectronics Reliability

Année:

2008

Langue:

english

Fichier:

PDF, 1.76 MB

english, 2008

2

Au–Sn flip-chip solder bump for microelectronic and optoelectronic applications

Jeong-Won Yoon, Hyun-Suk Chun, Ja-Myeong Koo, Seung-Boo Jung

Journal:

Microsystem Technologies

Année:

2007

Langue:

english

Fichier:

PDF, 452 KB

english, 2007

3

Mechanical Reliability of the Epoxy Sn-58wt.%Bi Solder Joints with Different Surface Finishes Under Thermal Shock

Sung, Yong-Gue, Myung, Woo-Ram, Jeong, Haksan, Ko, Min-Kwan, Moon, Jeonghoon, Jung, Seung-Boo

Journal:

Journal of Electronic Materials

Année:

2018

Langue:

english

Fichier:

PDF, 1.26 MB

english, 2018

4

Effect of Epoxy on Mechanical Property of SAC305 Solder Joint with Various Surface Finishes Under 3-Point Bend Test

Jeong, Haksan, Myung, Woo-Ram, Sung, Yong-Gue, Kim, Kyung-Yeol, Jung, Seung-Boo

Journal:

Journal of Nanoscience and Nanotechnology

Année:

2018

Langue:

english

Fichier:

PDF, 4.58 MB

english, 2018

5

Effects of isothermal aging and temperature–humidity treatment of substrate on joint reliability of Sn–3.0Ag–0.5Cu/OSP-finished Cu CSP solder joint

Jeong-Won Yoon, Bo-In Noh, Young-Ho Lee, Hyo-Soo Lee, Seung-Boo Jung

Journal:

Microelectronics Reliability

Année:

2008

Langue:

english

Fichier:

PDF, 1.09 MB

english, 2008

6

Reliability evaluations of flip chip package under thermal shock test

Dae-Gon Kim, Jong-Woong Kim, Seung-Boo Jung

Journal:

Microelectronic Engineering

Année:

2005

Langue:

english

Fichier:

PDF, 388 KB

english, 2005

7

Effect of displacement rate on ball shear properties for Sn–37Pb and Sn–3.5Ag BGA solder joints during isothermal aging

Ja-Myeong Koo, Seung-Boo Jung

Journal:

Microelectronics Reliability

Année:

2007

Langue:

english

Fichier:

PDF, 1.57 MB

english, 2007

8

Effect of high-speed loading conditions on the fracture mode of the BGA solder joint

Jong-Woong Kim, Jin-Kyu Jang, Sang-Ok Ha, Sang-Su Ha, Dae-Gon Kim, Seung-Boo Jung

Journal:

Microelectronics Reliability

Année:

2008

Langue:

english

Fichier:

PDF, 905 KB

english, 2008

9

Surface finishes of rolled copper foil for flexible printed circuit board

Chang-Yong Lee, Won-Chul Moon, Seung-Boo Jung

Journal:

Materials Science and Engineering: A

Année:

2008

Langue:

english

Fichier:

PDF, 861 KB

english, 2008

10

Effect of surface finish of substrate on mechanical reliability of In-48Sn solder joints in MOEMS package

Ja-Myeong Koo, Seung-Boo Jung

Journal:

Microsystem Technologies

Année:

2007

Langue:

english

Fichier:

PDF, 319 KB

english, 2007

11

Investigation of interfacial reaction and joint reliability between eutectic Sn–3.5Ag solder and ENIG-plated Cu substrate during high temperature storage test

Jeong-Won Yoon, Hyun-Suk Chun, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2007

Langue:

english

Fichier:

PDF, 673 KB

english, 2007

12

Interfacial reaction and mechanical properties between low melting temperature Sn–58Bi solder and various surface finishes during reflow reactions

Lee, Sang-Min, Yoon, Jeong-Won, Jung, Seung-Boo

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2015

Langue:

english

Fichier:

PDF, 4.55 MB

english, 2015

13

Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

Myung, Woo-Ram, Kim, Yongil, Kim, Kyung-Yeol, Jung, Seung-Boo

Journal:

Journal of Electronic Materials

Année:

2016

Langue:

english

Fichier:

PDF, 1.98 MB

english, 2016

14

Effects of Aging Treatment on Mechanical Properties of Sn-58Bi Epoxy Solder on ENEPIG-Surface-Finished PCB

Kim, Jungsoo, Myung, Woo-Ram, Jung, Seung-Boo

Journal:

Journal of Electronic Materials

Année:

2016

Langue:

english

Fichier:

PDF, 2.03 MB

english, 2016

15

Effects of oxidation on reliability of screen-printed silver circuits for radio frequency applications

Kim, Dae Up, Kim, Kwang-Seok, Jung, Seung-Boo

Journal:

Microelectronics Reliability

Année:

2016

Langue:

english

Fichier:

PDF, 1.13 MB

english, 2016

16

Sequential interfacial reactions of SAC305 solder joints with thin ENEPIG surface finishes

Yoon, Jeong-Won, Back, Jong-Hoon, Jung, Seung-Boo

Journal:

Surface and Interface Analysis

Année:

2018

Langue:

english

Fichier:

PDF, 1.40 MB

english, 2018

17

Thermal Resistance Analysis of Light-Emitting Diode Modules with Thermal Via Structure

Shin, Hyeong-Won, Jung, Seung-Boo, Lee, Hyo-Soo

Journal:

Journal of Electronic Materials

Année:

2018

Langue:

english

Fichier:

PDF, 2.77 MB

english, 2018

18

Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages

Jung, Kwang-Ho, Min, Kyung Deuk, Lee, Choong-Jae, Park, Bum-Geun, Jeong, Haksan, Koo, Ja-Myeong, Lee, Byunghoon, Jung, Seung-Boo

Journal:

Applied Surface Science

Année:

2019

Langue:

english

Fichier:

PDF, 5.80 MB

english, 2019

19

UV-responsive pressure sensitive adhesive for damage-free fabrication of ultrathin imperceptible mechanical sensor with ultrahigh optical transparency

Kim, Sang-Woo, Ju, Yun Hee, Han, Sangmoon, Kim, Jin-Soo, Lee, Hee-Jin, Han, Chul jong, Lee, Cheul-Ro, Jung, Seung-Boo, Kim, Youngmin, Kim, Jong-Woong

Journal:

Journal of Materials Chemistry A

Année:

2019

Langue:

english

Fichier:

PDF, 1.67 MB

english, 2019

20

UV-responsive pressure sensitive adhesive for damage-free fabrication of ultrathin imperceptible mechanical sensor with ultrahigh optical transparency

Kim, Sang-Woo, Ju, Yun Hee, Han, Sangmoon, Kim, Jin-Soo, Lee, Hee-Jin, Han, Chul jong, Lee, Cheul-Ro, Jung, Seung-Boo, Kim, Youngmin, Kim, Jong-Woong

Journal:

Journal of Materials Chemistry A

Année:

2019

Fichier:

PDF, 1.67 MB

2019

21

Effect of plasma treatment on adhesion characteristics at interfaces between underfill and substrate

Bo-In Noh, Chang-Sung Seok, Won-Chul Moon, Seung-Boo Jung

Journal:

International Journal of Adhesion and Adhesives

Année:

2007

Langue:

english

Fichier:

PDF, 723 KB

english, 2007

22

Reliability of Au bump flip chip packages with adhesive materials using four-point bending test

Bo-In Noh, Jeong-Won Yoon, Jong-Woong Kim, Jong-Bum Lee, Noh-Chang Park, Won-Sik Hong, Seung-Boo Jung

Journal:

International Journal of Adhesion and Adhesives

Année:

2009

Langue:

english

Fichier:

PDF, 449 KB

english, 2009

23

Evaluation of displacement rate effect in shear test of Sn–3Ag–0.5Cu solder bump for flip chip application

Jong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung

Journal:

Microelectronics Reliability

Année:

2006

Langue:

english

Fichier:

PDF, 717 KB

english, 2006

24

Effect of surface finish material on printed circuit board for electrochemical migration

Bo-In Noh, Jong-Bum Lee, Seung-Boo Jung

Journal:

Microelectronics Reliability

Année:

2008

Langue:

english

Fichier:

PDF, 913 KB

english, 2008

25

Solder joint reliability evaluation of Sn–Zn/Au/Ni/Cu ball-grid-array package during aging

Jeong-Won Yoon, Seung-Boo Jung

Journal:

Materials Science and Engineering: A

Année:

2007

Langue:

english

Fichier:

PDF, 3.14 MB

english, 2007

26

Reliability evaluation of Au–20Sn flip chip solder bump fabricated by sequential electroplating method with Sn and Au

Jeong-Won Yoon, Hyun-Suk Chun, Seung-Boo Jung

Journal:

Materials Science and Engineering: A

Année:

2008

Langue:

english

Fichier:

PDF, 1.26 MB

english, 2008

27

Interfacial reactions and joint reliability of Sn–9Zn solder on Cu or electrolytic Au/Ni/Cu BGA substrate

Chang-Yong Lee, Jeong-Won Yoon, Young-Jig Kim, Seung-Boo Jung

Journal:

Microelectronic Engineering

Année:

2005

Langue:

english

Fichier:

PDF, 647 KB

english, 2005

28

Interfacial reaction and joint reliability of fine-pitch flip-chip solder bump using stencil printing method

Sang-Su Ha, Dae-Gon Kim, Jong-Woong Kim, Jeong-Won Yoon, Jin-Ho Joo, Young-Eui Shin, Seung-Boo Jung

Journal:

Microelectronic Engineering

Année:

2007

Langue:

english

Fichier:

PDF, 961 KB

english, 2007

29

Mechanical reliability evaluation of Sn-37Pb solder joint using high speed lap-shear test

Seong-jae Jeon, Seungmin Hyun, Hak-Joo Lee, Jong-Woong Kim, Sang-Su Ha, Jeong-Won Yoon, Seung-Boo Jung, Hoo-Jeong Lee

Journal:

Microelectronic Engineering

Année:

2008

Langue:

english

Fichier:

PDF, 774 KB

english, 2008

30

Influence of current density on mechanical reliability of Sn–3.5Ag BGA solder joint

Sang-Su Ha, Ji-Yoon Sung, Jeong-Won Yoon, Seung-Boo Jung

Journal:

Microelectronic Engineering

Année:

2011

Langue:

english

Fichier:

PDF, 1.95 MB

english, 2011

31

Ultrasonic bonding for multi-chip packaging bonded with non-conductive film

Jong-Bum Lee, Jong-Gun Lee, Sang-Su Ha, Seung-Boo Jung

Journal:

Microelectronic Engineering

Année:

2011

Langue:

english

Fichier:

PDF, 464 KB

english, 2011

32

Fabrication and adhesion strength of Cu/Ni–Cr/polyimide films for flexible printed circuits

Bo-In Noh, Jeong-Won Yoon, Seung-Boo Jung

Journal:

Microelectronic Engineering

Année:

2011

Langue:

english

Fichier:

PDF, 523 KB

english, 2011

33

High temperature reliability and interfacial reaction of eutectic Sn–0.7Cu/Ni solder joints during isothermal aging

Jeong-Won Yoon, Seung-Boo Jung

Journal:

Microelectronics Reliability

Année:

2006

Langue:

english

Fichier:

PDF, 950 KB

english, 2006

34

Characteristic analysis of electroless Ni plating layer for electronic packaging

Dae-Gon Kim, Jong-Woong Kim, Jeong-Won Yoon, Won-Bae Lee, Seung-Boo Jung

Journal:

Surface and Interface Analysis

Année:

2006

Langue:

english

Fichier:

PDF, 190 KB

english, 2006

35

A study on μBGA solder joints reliability using lead-free solder materials

Young-Eui Shin, Jun Hwan Lee, Young-Wook Koh, Chong-Won Lee, Jun Ho Yun, Seung-Boo Jung

Journal:

Journal of Mechanical Science and Technology

Année:

2002

Langue:

english

Fichier:

PDF, 850 KB

english, 2002

36

Mechanical strength test method for solder ball joint in BGA package

Jong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung

Journal:

Metals and Materials International

Année:

2005

Langue:

english

Fichier:

PDF, 1.11 MB

english, 2005

37

Lap joint properties of FSWed dissimilar formed 5052 Al and 6061 Al alloys with different thickness

Chang-Yong Lee, Won-Bae Lee, Jong-Woong Kim, Don-Hyun Choi, Yun-Mo Yeon, Seung-Boo Jung

Journal:

Journal of Materials Science

Année:

2008

Langue:

english

Fichier:

PDF, 924 KB

english, 2008

38

Solid state intermetallic compound layer growth between Sn-8Zn-3Bi solder and bare copper substrate

Dae-Gon Kim, Hyung-Sun Jang, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2005

Langue:

english

Fichier:

PDF, 857 KB

english, 2005

39

Correlation between the interfacial reaction and mechanical joint strength of the flip chip solder bump during isothermal aging

Dae-Gon Kim, Hyung-Sun Jang, Jong-Woong Kim, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2005

Langue:

english

Fichier:

PDF, 1.15 MB

english, 2005

40

Electrical properties and interfacial reaction of BGA package with underfill

Bo-In Noh, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2008

Langue:

english

Fichier:

PDF, 289 KB

english, 2008

41

Effect of underfill on bending fatigue behavior of chip scale package

Bo-In Noh, Noh-Chang Park, Won-Sik Hong, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2008

Langue:

english

Fichier:

PDF, 334 KB

english, 2008

42

Characteristics of environmental factor for electrochemical migration on printed circuit board

Bo-In Noh, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2008

Langue:

english

Fichier:

PDF, 409 KB

english, 2008

43

Failure behaviors of BGA solder joints under various loading conditions of high-speed shear test

Jong-Woong Kim, Young-Chul Lee, Sang-Su Ha, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2009

Langue:

english

Fichier:

PDF, 727 KB

english, 2009

44

Adhesion characteristics of Cu/Ni–Cr/polyimide flexible copper clad laminates according to Ni:Cr ratio and Cu electroplating layer thickness

Bo-In Noh, Jeong-Won Yoon, Bo-Young Lee, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2009

Langue:

english

Fichier:

PDF, 478 KB

english, 2009

45

Interfacial reaction between Au–Sn solder and Au/Ni-metallized Kovar

Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2011

Langue:

english

Fichier:

PDF, 784 KB

english, 2011

46

Effect of adding Ce on interfacial reactions between Sn–Ag solder and Cu

Jeong-Won Yoon, Bo-In Noh, Jung-Hyun Choi, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2011

Langue:

english

Fichier:

PDF, 728 KB

english, 2011

47

Effects of different kinds of seed layers and heat treatment on adhesion characteristics of Cu/(Cr or Ni–Cr)/PI interfaces in flexible printed circuits

Bo-In Noh, Jeong-Won Yoon, Bo-Young Lee, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2011

Langue:

english

Fichier:

PDF, 675 KB

english, 2011

48

Microstructure of interfacial reaction layer in Sn–Ag–Cu/electroless Ni (P) solder joint

Han-Byul Kang, Jee-Hwan Bae, Jeong-Won Yoon, Seung-Boo Jung, Jongwoo Park, Cheol-Woong Yang

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2011

Langue:

english

Fichier:

PDF, 388 KB

english, 2011

49

Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders

Jeong-Won Yoon, Jong-Gun Lee, Jong-Bum Lee, Bo-In Noh, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2012

Langue:

english

Fichier:

PDF, 706 KB

english, 2012

50

Interfacial reactions and shear strengths between Sn-Ag-based Pb-free solder balls and Au/EN/Cu metallization

Sang-Won Kim, Jeong-Won Yoon, Seung-Boo Jung

Journal:

Journal of Electronic Materials

Année:

2004

Langue:

english

Fichier:

PDF, 1.22 MB

english, 2004